Ceramic Ultrasonic Machining

Non thermal process creates no haz and little or no subsurface damage.

Ceramic ultrasonic machining.

Ultrasonic machining new in 2018 ultrasonic technology enables the economical machining of complex workpiece geometries in demanding high tech materials like ceramics glass corundum tungsten carbide or even composites and notably the materion supremex material the kinematic overlapping of the tool rotation with an additional oscillation effects a reduction of the process forces by up to. The tool travels vertically or orthogonal to the surface of the part at amplitudes of 0 05 to 0 125 mm 0 002 to 0 005 in. During the operation the tool is pressed to the workpiece at a constant load. Ultrasonic machining is a low material removal rate mrr loose abrasive machining process in which the mirror image of a shaped tool can be created in hard brittle materials.

Ultrasonic machining um of ceramics is the machining method using the action of a slurry containing abrasive particles flowing between the workpiece and a tool vibrating at an ultrasonic frequency. Ultrasonic machining is the oldest form of machining process which can be used to machine brittle materials such as glass and ceramics. Diamond is cut for the desired shapes. Then a mechanistic approach to modeling the material removal rate during rotary ultrasonic drilling of ceramics is proposed and applied to predicting the material removal.

Optisonic 500 series entry level ultrasonic machining centers with 500mm of x axis travel the optisonic 500 series features 3 4 or 5 axes of motion in a robust platform that incorporates the latest ultrasonic technology and 500mm of x axis travel. Advantages of ultrasonic machining. Ultrasonic machining or strictly speaking the is a subtraction manufacturing process that removes material from the surface of a part through high frequency low amplitude vibrations of a tool against the material surface in the presence of fine abrasive particles. The amplitude of vibration 0 0005 0 002 13 50 μm.

Piercing of dies and for parting off operation. The vibration frequency is 19 25 khz. This is precise enough to be used in the creation of micro electro mechanical system components such as micro structured glass wafers. An experimental study of the rotary ultrasonic drilling of ceramics is first presented.

Material removal is achieved by the direct and indirect hammering of abrasive particles against a workpiece by means of an ultrasonically vibrating tool. Machining the glasses ceramics. Ultrasonic machining offers many advantages over conventional laser machining of ceramic substrates. As a result no post machining polishing or annealing processes are required to relieve residual stress and slag caused by laser.

Machining hard ceramics or soft optical materials has never been faster or easier. Lower total cost higher yield. The paper says about parametric optimization of ultrasonic. Ultrasonic machine is useful for hard material.